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Unread 4th May 2010, 09:12 PM
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windwithme windwithme is offline
Join Date: Jul 2009
Posts: 920
IO interface

4- WAY SLI bridge device. Exclusive ECP V2 panel

Except that the large-scale heat pipe to dispel the heat, additional fan is necessary to enhance the heat convection for X58

The independent heat sink mould dispels the heat for Mosfet, 10 phase Digital designed for CPU of power supplier

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